DAC's AI focus; 300mm fab report; foundry revenue; new auto chip org.; Micron earnings; rare earth exports plummet; UK's tech ...

Disaggregration requires traffic cops and in-chip monitors to function as expected over time. The shift from SoCs to ...

Ensuring trusted execution across multiple chiplets and vendors is more complex than in traditional monolithic SoCs.

Semiconductor devices are becoming thinner and more complex, making thin deposited films even harder to measure and control. With 3nm node devices in production and 2nm nodes ramping toward ...

An Agentic Approach for SoC Security Verification using Large Language Models” was published by researchers at University of ...

Hardware Trojans Detection Using GNN in RTL Designs” was published by researchers at University of Connecticut and University of Minnesota. Abstract “hip manufacturing is a complex process, and to ...

AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

Just because the various components in an advanced package work individually and together doesn't guarantee they will work ...

Researchers from the University of Massachusetts Amherst created silicon-based in-sensor visual processing arrays that can ...

Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, ...

Creating high-quality and high-performance autonomous and connected vehicles while mitigating safety risks across their ...

A new technical paper titled “Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes” was published by ...